³âµµ | PROJECT | |
---|---|---|
2011 | Hynix ¹ÝµµÃ¼(ÁÖ) Hynix Semiconductors |
ûÁÖ M11 Hook-Up (MF Coating ³³Ç°) Cheongju M11 Hook-Up (MF Coating delivery) |
LG µð½ºÇ÷¹ÀÌ(ÁÖ) LG Display |
ÆÄÁÖ ASSET In-Let V/V Paju ASSET In-Let V/V |
|
»ï¼ºÀüÀÚ(ÁÖ) ¾Æ»êÅÁÁ¤°øÀå Asan Tangjeong Plant, Samsung Electronics |
IN-LET V/V ³³Ç° IN-LET V/V delivered |
|
¸Å±×³ªÄ¨ ¹ÝµµÃ¼(À¯) MagnaChip Semiconductors |
A1-Joint Coating ³³Ç° A1-Joint Coating pipe laying construction |
³âµµ | PROJECT | |
---|---|---|
2010 | Hynix ¹ÝµµÃ¼(ÁÖ) Hynix Semiconductors |
- ûÁÖ M8, M9, M11 Hook-Up (A1-Joint Coating ³³Ç°) - ÀÌõ M10 Hook-Up (A1-Joint Coating ³³Ç°) - Cheongju M8, M9, M11 Hook-Up (A1-Joint Coating pipe laying construction) - Icheon M10 Hook-Up (A1-Joint Coating pipe laying construction) |
LG µð½ºÇ÷¹ÀÌ(ÁÖ) LG Display |
±¸¹Ì P6, P8 H-Vacuum In-Let V/V Gumi P6, P8 H-Vacuum In-Let V/V |
|
¸Å±×³ªÄ¨ ¹ÝµµÃ¼(À¯) MagnaChip Semiconductors |
IF-5, SR-1 Hook-Up (A1-Joint Coating ³³Ç°) IF-5, SR-1 Hook-Up (A1-Joint Coating pipe laying) |
³âµµ | PROJECT | |
---|---|---|
2009 ÀÌÀü Up to 2009 |
Hynix ¹ÝµµÃ¼(ÁÖ) Hynix Semiconductors |
- ûÁÖ M8, M9, M11 Hook-Up (A1-Joint Coating ³³Ç°) - ÀÌõ M10 Hook-Up (A1-Joint Coating ³³Ç°) - Cheongju M8, M9, M11 Hook-Up (A1-Joint Coating pipe laying) - Icheon M10 Hook-Up (A1-Joint Coating pipe laying) |
¸Å±×³ªÄ¨ ¹ÝµµÃ¼(À¯) MagnaChip Semiconductors |
F-5, SR-1 Hook-Up (A1-Joint Coating ³³Ç°) F-5, SR-1 Hook-Up (A1-Joint Coating pipe laying) |
|
LG µð½ºÇ÷¹ÀÌ(ÁÖ) LG Display |
±¸¹Ì P6, P8 H-Vacuum In-Let V/V Gumi P6, P8 H-Vacuum In-Let V/V |
|
¸Å±×³ªÄ¨ ¹ÝµµÃ¼(À¯) MagnaChip Semiconductors |
A1-Joint Coating ³³Ç° A1-Joint Coating pipe laying |
|
³Ø¼Ö·Ð Nexolon |
ÀÍ»ê°øÀå ÁõÃà°ø»ç H-Vacuum In-Let V/V Iksan plant expansion H-Vacuum In-Let V/V |
|
¿õÁø ÄÚ¿þÀÌ Woongjin Coway |
´ëÀü°øÀå H-Vacuum In-Let V/V Daejeon plant H-Vacuum In-Let V/V |
|
»ï¼ºÀüÀÚ(ÁÖ) Samsung Electronics |
ÅÁÁ¤Áö±¸ T8-Project Hook-Up ³³Ç° Tangjeong Area T8-Project Hook-Up pipe laying |